1. Thermal BondingPrinciple:Thermal bonding involves heating the microfluidic chip components (typically two layers of material) and then applying pressure to bond them together. The heat ...

At Kerch, we provide comprehensive microfluidic manufacturing solutions, covering the full process from prototype development to mass production. By integrating multiple fabrication technol...

At Kerch, we provide advanced microfluidic solutions using a variety of materials to meet the specific needs of your applications.Our materials are selected for their compatibility with both...